October 17, 2025, marked a significant milestone in the technology industry as NVIDIA officially announced the release of its first Blackwell chip wafer manufactured on U.S. soil. This move not only represents a major breakthrough in NVIDIA’s chip production strategy but also serves as a critical milestone in the development of the U.S. semiconductor manufacturing industry.
The Blackwell chip wafer released this time has its core production 环节 entrusted to TSMC, specifically completed at TSMC’s semiconductor factory in Phoenix, Arizona. The facility employs TSMC’s advanced 4-nanometer process technology, which is the core technological foundation for manufacturing NVIDIA’s latest-generation Blackwell GPU. This ensures the chip achieves industry-leading levels in performance, energy efficiency, and other key metrics, laying a solid foundation for future applications in high-end computing, artificial intelligence, and other fields.
During the launch event for the chip wafer, NVIDIA CEO Huang Renxun Special occasion visited TSMC’s advanced production facility in Arizona and delivered an important speech. He emphasized that the production of this critical chip wafer on U.S. soil is a significant breakthrough in modern American history — it is the first time that the world-leading advanced wafer manufacturer TSMC has produced core chips vital to the technology industry on American soil. Huang Renxun clearly stated that this collaborative achievement aligns perfectly with the U.S. government’s long-standing vision of “bringing manufacturing back to America.” It will inject strong momentum into the refinement and upgrading of the U.S. domestic semiconductor supply chain, while also helping to enhance the U.S.’s competitiveness and influence in the global semiconductor field.
However, it is important to note that the Blackwell chip wafers currently manufactured in the U.S. have not yet reached the final, ready-to-use product stage. According to subsequent production plans, these wafers will still need to be transported back to TSMC’s facility in Taiwan, where the final packaging process will be completed. After a series of rigorous inspections and adjustments, they will officially become NVIDIA B300 products and enter the market circulation phase, providing computing power support for various terminal devices and industry applications.
The launch of NVIDIA’s first U.S.-manufactured chip is not only a significant step in the company’s global production layout but also reflects new dynamics in supply chain division and regional cooperation under the current global semiconductor industry structure. The progress of its subsequent production processes and the performance after the product is launched into the market will continue to attract widespread attention from both inside and outside the industry.
